Gold in electronic waste
106 components in this guide contain gold. Spot price as of 4 Aug 2026: $4,060 per troy ounce ($131 per gram).
Richest sources by weight
| Component | Gold per lb | Value per lb | Tier |
|---|---|---|---|
| Precious-Metal Sputtering Targets | 454 g | $59,261 | S |
| Gold flat packs (military / aerospace) | 6 g | $783 | S |
| Gold-Filled Watch Cases & Bands | 6 g | $783 | S |
| Ceramic IC — gold lid + gold legs | 5 g | $653 | S |
| Ceramic CPU — gold lid + gold pins | 2.7 g | $352 | S |
| Pentium Pro | 2.6 g | $339 | S |
| Gold fingers (trimmed) | 2.5 g | $326 | S |
| Thick-Film Hybrid Microcircuits | 2.5 g | $326 | S |
| SIM & smart chip cards | 2.5 g | $326 | C |
| Pogo Pins & Spring-Loaded Test Probes | 2 g | $261 | S |
| Ceramic BGA / CCGA | 2 g | $261 | A |
| Ceramic CCD/CIS Image Sensors | 1.8 g | $235 | A |
These are yields per pound of that material, not per pound of whatever it came out of. That distinction is the single most common source of inflated figures online.
Everything containing gold
Ceramic CPU — gold lid + gold pins
Au 2.0–3.5 g/lbAg 0.5–2 g/lbBase Kovar
S
Ceramic IC — gold lid + gold legs
Au 3–8 g/lb wholeAg 0.5–3 g/lbBase Kovar
S
Gold fingers (trimmed)
Au 2.0–3.0 g/lbBase Cu
S
Gold flat packs (military / aerospace)
Au 3–10 g/lbAg 1–4 g/lb
S
Gold-Filled Watch Cases & Bands
Au 4–10 g/lb for clean marked GFBase brass core
S
Laboratory Platinum Ware
Pt ~454 g/lb — it is solid metalAu 5% in Pt-5%Au XRF fusion cruciblesBase Rh 5–10% in Pt-Rh crucibles
S
Pentium Pro
Au 0.25–0.45 g eachAg trace
S
Pogo Pins & Spring-Loaded Test Probes
Au 1.4–3.0 g/lbCu ~330 g/lbBase steel springs
S
Precious-Metal Sputtering Targets
Au ~454 g/lb — the target is solid metalPt 138 g in a 2 in × 0.125 in discPd 77 g in a 2 in × 0.125 in disc
S
Thick-Film Hybrid Microcircuits
Au 1.5–4 g/lb packaged; 5–10 g/lb stripped substratesAg 0–15 g/lb on Ag/Pd conductor variantsPd present in Ag/Pd pastes
S
Aerospace Connectors & Backshells
Au 0.3–0.8 g/lb complete; ~3.6 g/lb de-populated contactsCu ~80 g/lbBase Backshells: ~0 g Au/lb
A
BGA with gold tab / gold-corner BGA
Au 1.0–2.0 g/lbAg 0.3–1 g/lb
A
Cell phone boards
Au 0.09–0.50 g/lbAg 0.23–1.26 g/lbPd 0.025–0.07 g/lbCu 12–56%
A
Ceramic BGA / CCGA
Au 1–3 g/lbAg 0.5–2 g/lbBase alumina
A
Ceramic CCD/CIS Image Sensors
Au 0.02–0.15 g per ceramic package ≈ 1.8 g/lbAu under 0.001 g per mobile/webcam moduleBase Nd-Fe-B in VCM actuators
A
Ceramic CPU — no gold lid (black top)
Au 1.0–1.8 g/lbAg 0.3–1 g/lb
A
Ceramic IC — gold legs OR gold lid (not both)
Au 1.0–2.5 g/lbAg 0.5–2 g/lb
A
Fiber transceivers (SFP/GBIC/QSFP) ⚠
Au 0.5–1.5 g/lb (whole modules)Ag trace
A
Gold-fingered RAM
Au 0.3–0.6 g/lbAg 0.5–2 g/lbPd 0.01–0.05 g/lb
A
Gold-plated connectors
Au 0.3–1.0 g/lb wholeBase brass
A
Gold-plated pins
Au 0.7–1.5 g/lb mixedBase brass
A
IC Test, Burn-In & ZIF Sockets
Au 0.5–2 g/lb complete; 3–8 g/lb de-populated contactsCu ~60 g/lbPd Pd-Ni with gold flash on high-cycle sockets
A
Mil Circular Connectors (D38999/MS)
Au 0.20–0.50 g/lb whole; 2.5–4.0 g/lb de-pinned contactsCu ~80 g/lbBase 70–85% Al 6061-T6 shell
A
RF power transistors ☣
Au 0.5–2 g/lbBase Kovar
A
Telecom / military boards
Au 0.3–4 g/lbAg 1–8 g/lbPd 0.02–0.3 g/lbCu 15–25%
A
Telecom backplanes
Au 1–3 g/lb wholeAg 0.5–2 g/lbCu 20–30%
A
AMD ceramic with aluminium top (K6)
Au 0.7–1.2 g/lbBase Al plate
B
Card sockets — PCMCIA, CF, SD, SIM
Au 0.8–2.5 g/lbCu ~150 g/lb
B
Gold-plated hermetic transistors (TO-3/TO-5/TO-18)
Au 0.5–2 g/lbBase Kovar
B
Gold-plated SMD (SAW filters, RF modules, shields)
Au 0.5–1.5 g/lbAg 0.2–1 g/lb
B
Hard drive PCBs
Au 0.3–0.8 g/lbAg 0.5–2 g/lbCu 15–25%
B
IBM Multi-Chip / Thermal Conduction Modules
Au 1–5 g per module ≈ 0.3–0.7 g/lbCu ~48 g/lbBase Mo internal wiring
B
Laptop motherboards
Au 0.20–0.50 g/lbAg 1–3 g/lbPd 0.02–0.08 g/lbCu 15–25%
B
Machined-pin DIP sockets (gold barrel)
Au 1.0–2.4 g/lbCu ~250 g/lb
B
Plastic CPU with gold pins (P4, Athlon, S370/462/478)
Au 0.5–1.0 g/lbAg trace–0.3 g/lbCu IHS on P4
B
Plastic ICs — pre-2010 (gold bond wire)
Au 0.5–0.7 g/lbAg 0.2–1 g/lbPd trace–0.1 g/lb
B
Relays
Ag 2–20 g/lb of whole relayAu trace
B
RF Coaxial Connectors (SMA/N/BNC/TNC)
Au 0.10–0.40 g/lb (SMA); 0.01–0.05 g/lb (N/BNC)Cu ~190 g/lbAg trace
B
Server motherboards
Au 0.05–0.3 g/lbAg 1–3 g/lbPd 0.02–0.10 g/lbCu 15–25%
B
Slot 1 / Slot A cartridge CPU
Au 0.3–0.75 g/lb wholeAg trace–0.5 g/lb
B
Wire-wrap / pin boards
Au 0.6–1.5 g/lbAg 0.5–2 g/lbCu 20–30%
B
ABS, transmission & body control modules
Au 0.010–0.030 g per moduleAg 0.2–1.5 g in BCM relay contactsCu 40–120 g in the ABS pump motorBase 1.5–3 lb aluminium hydraulic block
C
Airbag control module (ACM/SDM/RCM)
Au 0.010–0.030 g per unitAg 0.05–0.2 g per unit
C
Arcade PCBs / JAMMA Boards
Au 0.05–0.20 g per board ≈ 0.09 g/lbCu ~45 g/lbAu ceramic gold-lid customs (FD1094
C
Automotive wiring harness
Cu 48–52% recovery stripped; ~35% as-pulledAu under 0.1 g per whole vehicle
C
Backup batteries & Dallas RTC modules ☠
Cu ~40 g/lbAu <0.1 g/lb
C
Beryllium copper contacts ☣
Au 0.5–1.5 g/lb when platedCu ~98%
C
Cables with Gold-Plated Connectors
Cu 150–250 g/lbAu 0.001–0.010 g/lbBase PVC jacket
C
Card-Edge Receptacles & Sockets
Au 0.15–0.50 g/lb for genuine gold-contact socketsCu ~130 g/lbBase 55–70% PBT/LCP/nylon
C
CPU socket (ZIF PGA / LGA)
Au 0.10–0.30 g/lb wholeBase phosphor bronze
C
Crystal oscillators & OCXO modules
Au 0.1–0.5 g/lb (modules)Ag 0.5–3 g/lb
C
DC-DC converter bricks & isolation modules
Au 0.08–0.3 g/lbAg 1–4 g/lbCu ~90 g/lb
C
Desktop motherboards
Au 0.02–0.15 g/lbAg 0.6–2 g/lbPd 0.01–0.05 g/lbCu 15–20%
C
DIP, Rotary & BCD Switches
Au 0.20–0.40 g/lb (DIP); 0.10–0.25 g/lb (rotary)Ag 1.0–2.5 g/lbBase 60–75% plastic/phenolic
C
ECU / engine control module
Au 0.11 g/lb of bare boardAg 0.45 g/lbPd 0.05 g/lbCu ~20% of board mass
C
Enterprise Switches, Line Cards & Optics
Au 0.15–0.6 g per large line card ≈ 0.075 g/lbCu ~70 g/lbBase chassis backplane
C
EV / hybrid battery management boards
Au 0.01–0.05 g per master boardAg ~0.1 g per master boardCu 10–50 g busbar traces per cell-tap board
C
Gold-fingered cards (untrimmed)
Au 0.2–0.5 g/lbAg 0.5–2 g/lbCu 15–25%
C
Graphics cards ⚠
Au 0.20–0.50 g/lbAg 0.5–2 g/lbCu 15–25%
C
HDD head arms & actuator assemblies
Au 0.1–0.3 g/lbNd NdFeB magnetsCu voice coil
C
Hybrid / EV traction inverter ⚡
Cu 3–8 kg per inverterAg 0.5–3 g sinter per power stageAu 0.02–0.08 g on gate-driver boardsBase 5–15 kg aluminium housing
C
Industrial Control Boards (PLC/DCS/SCADA)
Au 0.05–0.20 g/lb typical I/O; 0.25–0.60 g/lb CPU and backplanes; 0.6–1.5 g/lb 1970s–80s ceramic-DIP DCSAg 1–8 g per relay moduleCu ~113 g/lb
C
Instrument clusters & head units
Au 0.008–0.100 g per unitAg 0.2–0.6 g in a premium head unitPd 0.02–0.06 g in a premium head unitCu 20–500 g
C
Klystrons & Travelling-Wave Tubes
Cu ~250 g/lb (0.35–0.75 lb Cu per lb of tube)Au ~0.5–4 g per tubeAg 2–30 g per tube
C
Laptop Docking Stations
Au 0.04–0.12 g/lbCu 15–25 g/lbBase steel ballast plate in most
C
Laptop Power Adapters
Cu 60–90 g/lbAu traceBase glued PC/ABS shell
C
Mechanical & Vintage Keyboards
Au trace–0.05 g/lbCu 10–18 g/lbBase steel plate 30–50%
C
Modern lidded CPU (LGA775+, Core i, Ryzen)
Au 0.10–0.30 g/lbCu 15–25 g per chip
C
Peripheral & network cards
Au 0.20–0.50 g/lbAg 0.5–1.5 g/lbCu 15–25%
C
Pinball & Jukebox Electronics
Ag 1–3 g/lb on EM relay stacksCu 20–35 g/lbAu trace
C
POS & Payment Terminals
Au 0.05–0.20 g/lbCu 10–18 g/lbBase tamper coin cell on every board
C
Semiconductor Wafers & Fab Tooling
Au 0.0045 g/lb generic research-fab wafer scrapAu 7.4 g/lb for 1 µm gold-backed wafersBase quartz and SiC boats: zero metal
C
SIM & smart chip cards
Au 1.4–3.6 g/lb of punched modules
C
Turntable Cartridges & Styli
Au traceBase diamond stylus tips
C
Vacuum tubes
Au 0.1–0.5 g/lb (gold-pin types)Ag traceBase nickel plates
C
Vintage & Graphing Calculators
Au 0.05–0.30 g/lbBase NiCd packs in early rechargeables
C
Xenon HID ballasts & LED drivers
Au 0.003–0.015 g per ballastCu 30–90 g in the HV transformer and inductorsAg trace in thick-film and solder
C
Bridge rectifiers and power diodes
Cu 140–240 g/lbAg 0.5–2 g/lbAu ~0.02 g/lb
D
CCD Digital Cameras
Au 0.01–0.03 g/lbCu 8–15 g/lbBase Li-ion or AA power
D
Console Game Cartridges
Au 0.003–0.015 g per cartridge ≈ 0.04 g/lb wholeAu 0.6–0.9 g/lb of trimmed fingersCu negligible
D
DVD & Blu-ray Players
Cu 10–18 g/lbAu 0.002–0.008 g/lbBase steel case 50–70%
D
Floppy Drives (3.5″ & 5.25″)
Cu 20–35 g/lbAu 0.002–0.008 g/lbBase 60–80% steel chassis and shielding
D
Gold-Plated Flex Circuits (FFC/FPC/ZIF)
Au 0.05–0.15 g/lb of cableCu ~100 g/lbBase 60–80% polyimide/PET + acrylic
D
iPods & MP3 Players
Au 0.01–0.03 g/lbBase Li-poly cell in every unit
D
Laser Printer Boards, Fusers & Toner Chips
Au 0.01–0.04 g per formatter board ≈ 0.045 g/lbAu 0.0005–0.002 g per toner CRUM chip ≈ 0.3–0.8 g/lb of chipsBase Fuser: no precious metal whatsoever
D
LCD Panels (ITO / CCFL vs LED)
Base Indium ~0.4–0.8 g/m² of ITO layerAu 0.01–0.08 g per panel in COF tape bumpsCu ~17 g/lb
D
LEDs (through-hole and power SMD)
Au 0.02–0.08 g/lbAg 2–7 g/lbCu ~100 g/lb
D
Low-grade boards (PSU, TV, modem, appliance)
Au 0.005–0.05 g/lbAg 0.2–0.8 g/lbCu 8–15%
D
MAF, MAP, knock, crank & cam sensors
Pt 0.5–2 mg per hot-wire MAFAu 0.003–0.010 g per MAF boardAg 10–40 mg thick-film paste on MAP hybridsNd magnets in Hall-type crank/cam sensors
D
Optical Drives & Laser Pickups
Au 0.01–0.03 g per drive ≈ 0.011 g/lbCu ~16 g/lbBase Al 200–400 g
D
Optocouplers / optoisolators
Au 0.1–0.35 g/lbAg 2–5 g/lbCu ~120 g/lb
D
Photomultiplier Tubes (PMTs)
Ag 0.1–2 g per tubeAu 0–20 mg per tubeBase BeCu dynodes with an activated BeO surface
D
Power supplies
Au 0.005–0.03 g/lbCu 30–60 g per transformerAg in the relay
D
Reel-to-Reel Decks & Vintage Mics
Cu 25–40 g/lbBase Alnico magnets in mics and monitorsAu trace
D
Ribbon cable & IDC connectors
Au 0.3–0.8 g/lb (heads only)Cu 15–25% in the cable
D
RJ45 Jacks with Integrated Magnetics
Au 0.02–0.07 g/lbCu ~57 g/lbBase ferrite
D
Set-top / cable boxes
Au 0.03–0.10 g/lbAg 0.3–1 g/lbCu 10–15%
D
Tactile switches and metal dome contacts
Au 0.05–0.4 g/lbAg 1–3 g/lbCu ~60 g/lb
D
Tape Drives & Libraries (LTO/DLT/DAT)
Au 0.05–0.20 g per LTO drive ≈ 0.03 g/lbCu ~10 g/lbBase 0.7–1.8 kg aluminium per full-height drive
D
Thermal Printheads
Au 0.002–0.02 g per head ≈ 0.06 g/lbBase Ru as RuO2 glazeBase alumina substrate + Al heatsink bar
D
Trimmer Potentiometers (Cermet)
Au <0.15 g/lbBase Ru ~0.05–0.20 mg per unitPd <0.5 mg per unit
D
USB, HDMI, DisplayPort, RJ45 & audio jacks
Au 0.1–0.5 g/lbCu ~80 g/lb
D
VCRs & VHS Decks
Cu 25–40 g/lbBase Al head drum 80–150 gAu trace
D
Vintage Home Computers & Boards
Au 0.05–0.20 g per C64 board; 0.1–0.4 g per Apple II boardAu gold-lid ceramic DIPs at $150–400/lbCu ~40 g/lb
D
Whole hard drives
Au 0.05–0.15 g/lbNd magnetsBase aluminium casting
D
Zip & Jaz Drives
Cu 12–20 g/lbAu 0.005–0.015 g/lbBase plastic-heavy shells
D