Gold in electronic waste
90 components in this guide contain gold. Spot price as of 4 Aug 2026: $4,060 per troy ounce ($131 per gram).
Richest sources by weight
| Component | Gold per lb | Value per lb | Tier |
|---|---|---|---|
| Precious-Metal Sputtering Targets | 454 g | $59,261 | S |
| Gold flat packs (military / aerospace) | 6 g | $783 | S |
| Ceramic IC — gold lid + gold legs | 5 g | $653 | S |
| Ceramic CPU — gold lid + gold pins | 2.7 g | $352 | S |
| Pentium Pro | 2.6 g | $339 | S |
| Gold fingers (trimmed) | 2.5 g | $326 | S |
| Thick-Film Hybrid Microcircuits | 2.5 g | $326 | S |
| SIM & smart chip cards | 2.5 g | $326 | C |
| Pogo Pins & Spring-Loaded Test Probes | 2 g | $261 | S |
| Ceramic BGA / CCGA | 2 g | $261 | A |
| Ceramic CCD/CIS Image Sensors | 1.8 g | $235 | A |
| Ceramic IC — gold legs OR gold lid (not both) | 1.7 g | $222 | A |
These are yields per pound of that material, not per pound of whatever it came out of. That distinction is the single most common source of inflated figures online.
Everything containing gold
Ceramic CPU — gold lid + gold pins
Au 2.0–3.5 g/lbAg 0.5–2 g/lbBase Kovar
S
Ceramic IC — gold lid + gold legs
Au 3–8 g/lb wholeAg 0.5–3 g/lbBase Kovar
S
Gold fingers (trimmed)
Au 2.0–3.0 g/lbBase Cu
S
Gold flat packs (military / aerospace)
Au 3–10 g/lbAg 1–4 g/lb
S
Laboratory Platinum Ware
Pt ~454 g/lb — it is solid metalAu 5% in Pt-5%Au XRF fusion cruciblesBase Rh 5–10% in Pt-Rh crucibles
S
Pentium Pro
Au 0.25–0.45 g eachAg trace
S
Pogo Pins & Spring-Loaded Test Probes
Au 1.4–3.0 g/lbCu ~330 g/lbBase steel springs
S
Precious-Metal Sputtering Targets
Au ~454 g/lb — the target is solid metalPt 138 g in a 2 in × 0.125 in discPd 77 g in a 2 in × 0.125 in disc
S
Thick-Film Hybrid Microcircuits
Au 1.5–4 g/lb packaged; 5–10 g/lb stripped substratesAg 0–15 g/lb on Ag/Pd conductor variantsPd present in Ag/Pd pastes
S
Aerospace Connectors & Backshells
Au 0.3–0.8 g/lb complete; ~3.6 g/lb de-populated contactsCu ~80 g/lbBase Backshells: ~0 g Au/lb
A
BGA with gold tab / gold-corner BGA
Au 1.0–2.0 g/lbAg 0.3–1 g/lb
A
Cell phone boards
Au 0.09–0.50 g/lbAg 0.23–1.26 g/lbPd 0.025–0.07 g/lbCu 12–56%
A
Ceramic BGA / CCGA
Au 1–3 g/lbAg 0.5–2 g/lbBase alumina
A
Ceramic CCD/CIS Image Sensors
Au 0.02–0.15 g per ceramic package ≈ 1.8 g/lbAu under 0.001 g per mobile/webcam moduleBase Nd-Fe-B in VCM actuators
A
Ceramic CPU — no gold lid (black top)
Au 1.0–1.8 g/lbAg 0.3–1 g/lb
A
Ceramic IC — gold legs OR gold lid (not both)
Au 1.0–2.5 g/lbAg 0.5–2 g/lb
A
Fiber transceivers (SFP/GBIC/QSFP) ⚠
Au 0.5–1.5 g/lb (whole modules)Ag trace
A
Gold-fingered RAM
Au 0.3–0.6 g/lbAg 0.5–2 g/lbPd 0.01–0.05 g/lb
A
Gold-plated connectors
Au 0.3–1.0 g/lb wholeBase brass
A
Gold-plated pins
Au 0.7–1.5 g/lb mixedBase brass
A
IC Test, Burn-In & ZIF Sockets
Au 0.5–2 g/lb complete; 3–8 g/lb de-populated contactsCu ~60 g/lbPd Pd-Ni with gold flash on high-cycle sockets
A
Mil Circular Connectors (D38999/MS)
Au 0.20–0.50 g/lb whole; 2.5–4.0 g/lb de-pinned contactsCu ~80 g/lbBase 70–85% Al 6061-T6 shell
A
RF power transistors ☣
Au 0.5–2 g/lbBase Kovar
A
Telecom / military boards
Au 0.3–4 g/lbAg 1–8 g/lbPd 0.02–0.3 g/lbCu 15–25%
A
Telecom backplanes
Au 1–3 g/lb wholeAg 0.5–2 g/lbCu 20–30%
A
AMD ceramic with aluminium top (K6)
Au 0.7–1.2 g/lbBase Al plate
B
Card sockets — PCMCIA, CF, SD, SIM
Au 0.8–2.5 g/lbCu ~150 g/lb
B
Gold-plated hermetic transistors (TO-3/TO-5/TO-18)
Au 0.5–2 g/lbBase Kovar
B
Gold-plated SMD (SAW filters, RF modules, shields)
Au 0.5–1.5 g/lbAg 0.2–1 g/lb
B
Hard drive PCBs
Au 0.3–0.8 g/lbAg 0.5–2 g/lbCu 15–25%
B
IBM Multi-Chip / Thermal Conduction Modules
Au 1–5 g per module ≈ 0.3–0.7 g/lbCu ~48 g/lbBase Mo internal wiring
B
Laptop motherboards
Au 0.20–0.50 g/lbAg 1–3 g/lbPd 0.02–0.08 g/lbCu 15–25%
B
Machined-pin DIP sockets (gold barrel)
Au 1.0–2.4 g/lbCu ~250 g/lb
B
Plastic CPU with gold pins (P4, Athlon, S370/462/478)
Au 0.5–1.0 g/lbAg trace–0.3 g/lbCu IHS on P4
B
Plastic ICs — pre-2010 (gold bond wire)
Au 0.5–0.7 g/lbAg 0.2–1 g/lbPd trace–0.1 g/lb
B
Relays
Ag 2–20 g/lb of whole relayAu trace
B
RF Coaxial Connectors (SMA/N/BNC/TNC)
Au 0.10–0.40 g/lb (SMA); 0.01–0.05 g/lb (N/BNC)Cu ~190 g/lbAg trace
B
Server motherboards
Au 0.05–0.3 g/lbAg 1–3 g/lbPd 0.02–0.10 g/lbCu 15–25%
B
Slot 1 / Slot A cartridge CPU
Au 0.3–0.75 g/lb wholeAg trace–0.5 g/lb
B
Wire-wrap / pin boards
Au 0.6–1.5 g/lbAg 0.5–2 g/lbCu 20–30%
B
ABS, transmission & body control modules
Au 0.010–0.030 g per moduleAg 0.2–1.5 g in BCM relay contactsCu 40–120 g in the ABS pump motorBase 1.5–3 lb aluminium hydraulic block
C
Airbag control module (ACM/SDM/RCM)
Au 0.010–0.030 g per unitAg 0.05–0.2 g per unit
C
Arcade PCBs / JAMMA Boards
Au 0.05–0.20 g per board ≈ 0.09 g/lbCu ~45 g/lbAu ceramic gold-lid customs (FD1094
C
Automotive wiring harness
Cu 48–52% recovery stripped; ~35% as-pulledAu under 0.1 g per whole vehicle
C
Backup batteries & Dallas RTC modules ☠
Cu ~40 g/lbAu <0.1 g/lb
C
Beryllium copper contacts ☣
Au 0.5–1.5 g/lb when platedCu ~98%
C
Card-Edge Receptacles & Sockets
Au 0.15–0.50 g/lb for genuine gold-contact socketsCu ~130 g/lbBase 55–70% PBT/LCP/nylon
C
CPU socket (ZIF PGA / LGA)
Au 0.10–0.30 g/lb wholeBase phosphor bronze
C
Crystal oscillators & OCXO modules
Au 0.1–0.5 g/lb (modules)Ag 0.5–3 g/lb
C
DC-DC converter bricks & isolation modules
Au 0.08–0.3 g/lbAg 1–4 g/lbCu ~90 g/lb
C
Desktop motherboards
Au 0.02–0.15 g/lbAg 0.6–2 g/lbPd 0.01–0.05 g/lbCu 15–20%
C
DIP, Rotary & BCD Switches
Au 0.20–0.40 g/lb (DIP); 0.10–0.25 g/lb (rotary)Ag 1.0–2.5 g/lbBase 60–75% plastic/phenolic
C
ECU / engine control module
Au 0.11 g/lb of bare boardAg 0.45 g/lbPd 0.05 g/lbCu ~20% of board mass
C
Enterprise Switches, Line Cards & Optics
Au 0.15–0.6 g per large line card ≈ 0.075 g/lbCu ~70 g/lbBase chassis backplane
C
EV / hybrid battery management boards
Au 0.01–0.05 g per master boardAg ~0.1 g per master boardCu 10–50 g busbar traces per cell-tap board
C
Gold-fingered cards (untrimmed)
Au 0.2–0.5 g/lbAg 0.5–2 g/lbCu 15–25%
C
Graphics cards ⚠
Au 0.20–0.50 g/lbAg 0.5–2 g/lbCu 15–25%
C
HDD head arms & actuator assemblies
Au 0.1–0.3 g/lbNd NdFeB magnetsCu voice coil
C
Hybrid / EV traction inverter ⚡
Cu 3–8 kg per inverterAg 0.5–3 g sinter per power stageAu 0.02–0.08 g on gate-driver boardsBase 5–15 kg aluminium housing
C
Industrial Control Boards (PLC/DCS/SCADA)
Au 0.05–0.20 g/lb typical I/O; 0.25–0.60 g/lb CPU and backplanes; 0.6–1.5 g/lb 1970s–80s ceramic-DIP DCSAg 1–8 g per relay moduleCu ~113 g/lb
C
Instrument clusters & head units
Au 0.008–0.100 g per unitAg 0.2–0.6 g in a premium head unitPd 0.02–0.06 g in a premium head unitCu 20–500 g
C
Klystrons & Travelling-Wave Tubes
Cu ~250 g/lb (0.35–0.75 lb Cu per lb of tube)Au ~0.5–4 g per tubeAg 2–30 g per tube
C
Modern lidded CPU (LGA775+, Core i, Ryzen)
Au 0.10–0.30 g/lbCu 15–25 g per chip
C
Peripheral & network cards
Au 0.20–0.50 g/lbAg 0.5–1.5 g/lbCu 15–25%
C
Semiconductor Wafers & Fab Tooling
Au 0.0045 g/lb generic research-fab wafer scrapAu 7.4 g/lb for 1 µm gold-backed wafersBase quartz and SiC boats: zero metal
C
SIM & smart chip cards
Au 1.4–3.6 g/lb of punched modules
C
Vacuum tubes
Au 0.1–0.5 g/lb (gold-pin types)Ag traceBase nickel plates
C
Xenon HID ballasts & LED drivers
Au 0.003–0.015 g per ballastCu 30–90 g in the HV transformer and inductorsAg trace in thick-film and solder
C
Bridge rectifiers and power diodes
Cu 140–240 g/lbAg 0.5–2 g/lbAu ~0.02 g/lb
D
Console Game Cartridges
Au 0.003–0.015 g per cartridge ≈ 0.04 g/lb wholeAu 0.6–0.9 g/lb of trimmed fingersCu negligible
D
Gold-Plated Flex Circuits (FFC/FPC/ZIF)
Au 0.05–0.15 g/lb of cableCu ~100 g/lbBase 60–80% polyimide/PET + acrylic
D
Laser Printer Boards, Fusers & Toner Chips
Au 0.01–0.04 g per formatter board ≈ 0.045 g/lbAu 0.0005–0.002 g per toner CRUM chip ≈ 0.3–0.8 g/lb of chipsBase Fuser: no precious metal whatsoever
D
LCD Panels (ITO / CCFL vs LED)
Base Indium ~0.4–0.8 g/m² of ITO layerAu 0.01–0.08 g per panel in COF tape bumpsCu ~17 g/lb
D
LEDs (through-hole and power SMD)
Au 0.02–0.08 g/lbAg 2–7 g/lbCu ~100 g/lb
D
Low-grade boards (PSU, TV, modem, appliance)
Au 0.005–0.05 g/lbAg 0.2–0.8 g/lbCu 8–15%
D
MAF, MAP, knock, crank & cam sensors
Pt 0.5–2 mg per hot-wire MAFAu 0.003–0.010 g per MAF boardAg 10–40 mg thick-film paste on MAP hybridsNd magnets in Hall-type crank/cam sensors
D
Optical Drives & Laser Pickups
Au 0.01–0.03 g per drive ≈ 0.011 g/lbCu ~16 g/lbBase Al 200–400 g
D
Optocouplers / optoisolators
Au 0.1–0.35 g/lbAg 2–5 g/lbCu ~120 g/lb
D
Photomultiplier Tubes (PMTs)
Ag 0.1–2 g per tubeAu 0–20 mg per tubeBase BeCu dynodes with an activated BeO surface
D
Power supplies
Au 0.005–0.03 g/lbCu 30–60 g per transformerAg in the relay
D
Ribbon cable & IDC connectors
Au 0.3–0.8 g/lb (heads only)Cu 15–25% in the cable
D
RJ45 Jacks with Integrated Magnetics
Au 0.02–0.07 g/lbCu ~57 g/lbBase ferrite
D
Set-top / cable boxes
Au 0.03–0.10 g/lbAg 0.3–1 g/lbCu 10–15%
D
Tactile switches and metal dome contacts
Au 0.05–0.4 g/lbAg 1–3 g/lbCu ~60 g/lb
D
Tape Drives & Libraries (LTO/DLT/DAT)
Au 0.05–0.20 g per LTO drive ≈ 0.03 g/lbCu ~10 g/lbBase 0.7–1.8 kg aluminium per full-height drive
D
Thermal Printheads
Au 0.002–0.02 g per head ≈ 0.06 g/lbBase Ru as RuO2 glazeBase alumina substrate + Al heatsink bar
D
Trimmer Potentiometers (Cermet)
Au <0.15 g/lbBase Ru ~0.05–0.20 mg per unitPd <0.5 mg per unit
D
USB, HDMI, DisplayPort, RJ45 & audio jacks
Au 0.1–0.5 g/lbCu ~80 g/lb
D
Vintage Home Computers & Boards
Au 0.05–0.20 g per C64 board; 0.1–0.4 g per Apple II boardAu gold-lid ceramic DIPs at $150–400/lbCu ~40 g/lb
D
Whole hard drives
Au 0.05–0.15 g/lbNd magnetsBase aluminium casting
D