Silver in electronic waste
70 components in this guide contain silver. Spot price as of 4 Aug 2026: $59.1 per troy ounce ($1.90 per gram).
Richest sources by weight
| Component | Silver per lb | Value per lb | Tier |
|---|---|---|---|
| Sterling & Silver-Plated Flatware | 420 g | $798 | S |
| Silver-Graphite Brushes & Slip Rings | 363 g | $690 | S |
| Silver contacts (switches, breakers, contactors) | 280 g | $532 | S |
| Silver-Oxide Button Cells | 150 g | $285 | S |
| Silver mica capacitors | 14 g | $26.6 | C |
| MLCC — palladium-bearing (PME, pre-2000) | 10 g | $19.0 | S |
| Chip antennas (LTCC ceramic) | 10 g | $19.0 | D |
| Metal oxide varistors (MOVs) | 9 g | $17.1 | C |
| Relays | 8 g | $15.2 | B |
| Ceramic disc capacitors | 7 g | $13.3 | C |
| Tantalum capacitors | 6 g | $11.4 | B |
| Solar cells & panels | 5 g | $9.50 | C |
These are yields per pound of that material, not per pound of whatever it came out of. That distinction is the single most common source of inflated figures online.
Everything containing silver
Ceramic CPU — gold lid + gold pins
Au 2.0–3.5 g/lbAg 0.5–2 g/lbBase Kovar
S
Ceramic IC — gold lid + gold legs
Au 3–8 g/lb wholeAg 0.5–3 g/lbBase Kovar
S
Gold flat packs (military / aerospace)
Au 3–10 g/lbAg 1–4 g/lb
S
MLCC — palladium-bearing (PME, pre-2000)
Pd 2.3–9 g/lbAg 4.5–23 g/lbBase Ni
S
Pentium Pro
Au 0.25–0.45 g eachAg trace
S
Silver contacts (switches, breakers, contactors)
Ag 180–400 g/lb of clean cut contacts
S
Silver-Graphite Brushes & Slip Rings
Ag 40–95% by weightCu pigtail + commutator segmentsBase electrographite
S
Silver-Oxide Button Cells
Ag ~30–35% by weight ≈ 150 g/lbBase Zn anode ~25%Base LR/AG alkaline
S
Sterling & Silver-Plated Flatware
Ag 92.5% ≈ 420 g/lb sterlingAg hollow-handle knives: only 8–20 g per pieceAg silver plate: ~0.1–0.5 g per teaspoon
S
Thick-Film Hybrid Microcircuits
Au 1.5–4 g/lb packaged; 5–10 g/lb stripped substratesAg 0–15 g/lb on Ag/Pd conductor variantsPd present in Ag/Pd pastes
S
BGA with gold tab / gold-corner BGA
Au 1.0–2.0 g/lbAg 0.3–1 g/lb
A
Cell phone boards
Au 0.09–0.50 g/lbAg 0.23–1.26 g/lbPd 0.025–0.07 g/lbCu 12–56%
A
Ceramic BGA / CCGA
Au 1–3 g/lbAg 0.5–2 g/lbBase alumina
A
Ceramic CPU — no gold lid (black top)
Au 1.0–1.8 g/lbAg 0.3–1 g/lb
A
Ceramic IC — gold legs OR gold lid (not both)
Au 1.0–2.5 g/lbAg 0.5–2 g/lb
A
Fiber transceivers (SFP/GBIC/QSFP) ⚠
Au 0.5–1.5 g/lb (whole modules)Ag trace
A
Gold-fingered RAM
Au 0.3–0.6 g/lbAg 0.5–2 g/lbPd 0.01–0.05 g/lb
A
Telecom / military boards
Au 0.3–4 g/lbAg 1–8 g/lbPd 0.02–0.3 g/lbCu 15–25%
A
Telecom backplanes
Au 1–3 g/lb wholeAg 0.5–2 g/lbCu 20–30%
A
Gold-plated SMD (SAW filters, RF modules, shields)
Au 0.5–1.5 g/lbAg 0.2–1 g/lb
B
Hard drive PCBs
Au 0.3–0.8 g/lbAg 0.5–2 g/lbCu 15–25%
B
Laptop motherboards
Au 0.20–0.50 g/lbAg 1–3 g/lbPd 0.02–0.08 g/lbCu 15–25%
B
Plastic CPU with gold pins (P4, Athlon, S370/462/478)
Au 0.5–1.0 g/lbAg trace–0.3 g/lbCu IHS on P4
B
Plastic ICs — pre-2010 (gold bond wire)
Au 0.5–0.7 g/lbAg 0.2–1 g/lbPd trace–0.1 g/lb
B
Relays
Ag 2–20 g/lb of whole relayAu trace
B
RF Coaxial Connectors (SMA/N/BNC/TNC)
Au 0.10–0.40 g/lb (SMA); 0.01–0.05 g/lb (N/BNC)Cu ~190 g/lbAg trace
B
Server motherboards
Au 0.05–0.3 g/lbAg 1–3 g/lbPd 0.02–0.10 g/lbCu 15–25%
B
Silver-Plated Copper Wire & Coax
Ag 2.8–6.8 g/lb as-received; 5.7–11.3 g/lb stripped conductorCu ~230 g/lbBase 40–55% PTFE/FEP
B
Slot 1 / Slot A cartridge CPU
Au 0.3–0.75 g/lb wholeAg trace–0.5 g/lb
B
Tantalum capacitors
Ta 30–40 wt% of the capAg 1–3% in some
B
Thermostats, Snap Discs & Limit Switches
Ag 0.4–1.6 g/lb as whole discs; 408–431 g/lb as harvested contactsBase bimetal steel discBase Hg ~3–4 g per bulb thermostat ampoule
B
Wire-wrap / pin boards
Au 0.6–1.5 g/lbAg 0.5–2 g/lbCu 20–30%
B
X-Ray Film & Spent Fixer
Ag 0.07–0.10 ozt/lb (2.2–3.1 g/lb) medical filmAg 0.15–0.25 ozt/lb industrial NDT filmAg 1–6 g/L in spent fixer
B
ABS, transmission & body control modules
Au 0.010–0.030 g per moduleAg 0.2–1.5 g in BCM relay contactsCu 40–120 g in the ABS pump motorBase 1.5–3 lb aluminium hydraulic block
C
Airbag control module (ACM/SDM/RCM)
Au 0.010–0.030 g per unitAg 0.05–0.2 g per unit
C
Automotive relays & fuse boxes
Ag 25–80 mg per mini ISO relayCu 1–3 g coil + terminals per relay
C
Ceramic disc capacitors
Ag 4–10 g/lbPd 0.05–0.3 g/lb
C
Crystal oscillators & OCXO modules
Au 0.1–0.5 g/lb (modules)Ag 0.5–3 g/lb
C
DC-DC converter bricks & isolation modules
Au 0.08–0.3 g/lbAg 1–4 g/lbCu ~90 g/lb
C
Desktop motherboards
Au 0.02–0.15 g/lbAg 0.6–2 g/lbPd 0.01–0.05 g/lbCu 15–20%
C
DIP, Rotary & BCD Switches
Au 0.20–0.40 g/lb (DIP); 0.10–0.25 g/lb (rotary)Ag 1.0–2.5 g/lbBase 60–75% plastic/phenolic
C
ECU / engine control module
Au 0.11 g/lb of bare boardAg 0.45 g/lbPd 0.05 g/lbCu ~20% of board mass
C
EV / hybrid battery management boards
Au 0.01–0.05 g per master boardAg ~0.1 g per master boardCu 10–50 g busbar traces per cell-tap board
C
Gold-fingered cards (untrimmed)
Au 0.2–0.5 g/lbAg 0.5–2 g/lbCu 15–25%
C
Graphics cards ⚠
Au 0.20–0.50 g/lbAg 0.5–2 g/lbCu 15–25%
C
Hybrid / EV traction inverter ⚡
Cu 3–8 kg per inverterAg 0.5–3 g sinter per power stageAu 0.02–0.08 g on gate-driver boardsBase 5–15 kg aluminium housing
C
Industrial Control Boards (PLC/DCS/SCADA)
Au 0.05–0.20 g/lb typical I/O; 0.25–0.60 g/lb CPU and backplanes; 0.6–1.5 g/lb 1970s–80s ceramic-DIP DCSAg 1–8 g per relay moduleCu ~113 g/lb
C
Instrument clusters & head units
Au 0.008–0.100 g per unitAg 0.2–0.6 g in a premium head unitPd 0.02–0.06 g in a premium head unitCu 20–500 g
C
Klystrons & Travelling-Wave Tubes
Cu ~250 g/lb (0.35–0.75 lb Cu per lb of tube)Au ~0.5–4 g per tubeAg 2–30 g per tube
C
Metal oxide varistors (MOVs)
Ag 6–14 g/lb
C
MLCC — modern nickel (BME, post-2005)
Pd 0.2–0.7 g/lbAg 1.4–2.7 g/lbBase Ni 5–20%
C
Peripheral & network cards
Au 0.20–0.50 g/lbAg 0.5–1.5 g/lbCu 15–25%
C
Silver mica capacitors
Ag 10–20 g/lbCu ~60 g/lb
C
Solar cells & panels
Ag 3–8 g/lb of bare cellsBase 2–3 kg aluminium frame
C
Thick-film resistor networks (SIP/DIP)
Ag 2–5 g/lbPd 0.2–0.7 g/lb
C
Vacuum tubes
Au 0.1–0.5 g/lb (gold-pin types)Ag traceBase nickel plates
C
Xenon HID ballasts & LED drivers
Au 0.003–0.015 g per ballastCu 30–90 g in the HV transformer and inductorsAg trace in thick-film and solder
C
Bridge rectifiers and power diodes
Cu 140–240 g/lbAg 0.5–2 g/lbAu ~0.02 g/lb
D
Ceramic HRC fuses (and glass fuses)
Ag 1–3 g/lbCu ~90 g/lb
D
Chip antennas (LTCC ceramic)
Ag 6–18 g/lb
D
LEDs (through-hole and power SMD)
Au 0.02–0.08 g/lbAg 2–7 g/lbCu ~100 g/lb
D
Low-grade boards (PSU, TV, modem, appliance)
Au 0.005–0.05 g/lbAg 0.2–0.8 g/lbCu 8–15%
D
MAF, MAP, knock, crank & cam sensors
Pt 0.5–2 mg per hot-wire MAFAu 0.003–0.010 g per MAF boardAg 10–40 mg thick-film paste on MAP hybridsNd magnets in Hall-type crank/cam sensors
D
Magnetron ☣☣
Ag 0.5–2 g per magnetronCu 200–400 g per unitBase ferrite magnets
D
Optocouplers / optoisolators
Au 0.1–0.35 g/lbAg 2–5 g/lbCu ~120 g/lb
D
Photomultiplier Tubes (PMTs)
Ag 0.1–2 g per tubeAu 0–20 mg per tubeBase BeCu dynodes with an activated BeO surface
D
Power supplies
Au 0.005–0.03 g/lbCu 30–60 g per transformerAg in the relay
D
Set-top / cable boxes
Au 0.03–0.10 g/lbAg 0.3–1 g/lbCu 10–15%
D
Tactile switches and metal dome contacts
Au 0.05–0.4 g/lbAg 1–3 g/lbCu ~60 g/lb
D
Thermistors (NTC/PTC) and piezo elements
Ag 2–5 g/lb
D